Call for Industry Papers: Industrial Systems and Software Product Lines in Practice

Taking advantage of the economy of scale, saving on commodity assets shared by a family of products, or adopting innovation fast in a portfolio of products and services are strong motivators for product line engineering. Many organisations benefited from product line practices with increased customizability and quality while significantly reducing time-to-market and costs of engineering and maintaining software-intensive products. However, applying product line engineering also encounters a wide range of challenges and compromises, that can hinder their success and adoption. Reuse requires investment and following a strategy, given the speed at which environments change that seems contradictory. The pursuit of adaptability and flexibility, new technologies including artificial intelligence, digital twins, blockchain, and cyber-security technologies as well as crises such as the Covid-19 pandemic and supply chains threatened by geo-political conflicts are posing new challenges – but offering new opportunities on the other hand. We seek contributions from industry and academia on applications of product line engineering to software and systems in practice, sharing their specifics, challenges, successes, and evaluations in all stages of technology readiness levels. We welcome contributions from industries applying modular platform concepts to manage reuse in hardware and mechatronic systems, e.g., providers of industrial equipment, automotive, appliances, semiconductors and more.

SPLC will take the special confidentially requirements of industry participants into account, e.g., refraining from publishing full papers on request.


We solicit papers on the following topics (but not limited to):

  • Adopting or migrating to product line engineering
  • Scoping of product/solution portfolios and assets
  • Architecture, design, and implementation of product lines
  • Process aspects, e.g., DevOps and agile processes
  • Strategic reuse in the face of increasing volatility and uncertainty 
  • Variability management across all lifecycle stages
  • Model driven and model-based engineering
  • Organizational and business aspects, e.g., business ecosystems
  • Continuous integration and deployment
  • Artificial intelligence, including deep and machine learning technologies
  • Cybersecurity and blockchain technologies
  • Other novel technologies, e.g., digital twins, quantum computing, HPC, Exascale computing, Cloud/Edge/IoT computing and mobile networks (B5G)
  • Modular platforms (“Baukasten”) for hardware and mechatronic systems
  • Quality and non-functional properties
  • Software ecosystems, e.g., Android apps
  • Tools and methods for guidance and governance
  • Comparison and assessment of tools in the industry
  • Product line testing, verification, and validation
  • Version and configuration management
  • Disruptive innovations and their effects on product lines
  • Strategic reuse attempts that failed


Full papers – Reporting experience from product line applications, preferably from but not limited to an industry domain. The papers in this category must provide sufficient context of the problems identified or addressed, describe clear requirements and/or experiences in solving them, provide an assessment of benefits and drawbacks or other lessons learned, and explain why the contribution is innovative or valuable for others.

Short papers – Describing early returns on new product line and software ecosystem applications and projects, or other shorter topics of interest.

Industrial Presentations – A short abstract from the industry for a presentation on any of the topics mentioned above from the industrial practice.

The page limit is 10 pages for full papers, and 5 pages for short papers, not including references (2 extra pages maximum). The abstract for an industrial presentation shall fit into one page. Submissions must follow the 20XX ACM Master Article Template and will be reviewed by at least 3 members of the program committee for the Industrial Systems and Software Product Lines in Practice track.

Submissions must adhere to the latest ACM Master Article Template:

Latex users should use the “sigconf” option, so they are recommended to use the template that can be found in “sample-sigconf.tex”. In this way, the following latex code can be placed at the start of the latex document to create a double column layout:

\acmConference[SPLC'23]{27th International Systems and Software Product Line Conference}{August 28--September 1, 2023}{Tokyo, Japan}

The SPLC proceedings will be published in the ACM Digital Library.

By submitting your article to an ACM Publication, you are hereby acknowledging that you and your co-authors are subject to all ACM Publications Policies, including ACM’s new Publications Policy on Research Involving Human Participants and Subjects. Alleged violations of this policy or any ACM Publications Policy will be investigated by ACM and may result in a full retraction of your paper, in addition to other potential penalties, as per ACM Publications Policy.

Please ensure that you and your co-authors obtain an ORCID ID, so you can complete the publishing process for your accepted paper. ACM has been involved in ORCID from the start and we have recently made a commitment to collect ORCID IDs from all of our published authors. The collection process has started and will roll out as a requirement throughout 2022. We are committed to improve author discoverability, ensure proper attribution and contribute to ongoing community efforts around name normalization; your ORCID ID will help in these efforts.

Submissions will be reviewed by at least 3 members of the program committee for the Industrial Systems and Software Product Lines in Practice track.

The author of the accepted submission must pay a full registration fee for the submission to be published. SPLC 2023 is primarily a physical event and papers are expected to be presented on site, except where no co-author is able to attend SPLC 2023 in Tokyo. If any co-author of a paper is attending physically, they will need to present the paper. If no co-author is able to come to Tokyo to present an accepted paper, we ask that you let us know for which paper no co-author is able to present in-person. Such remote presenters will be accommodated for presenting online, live where feasible or else via a recording in exceptional circumstances.

Submission link

Submissions should be sent using EasyChair: (Industrial Track)

Important Dates (AoE time)

Industrial presentations:

  • Abstract submission: April 13, 2023
  • Notification: June 9, 2023
  • Camera-ready paper: June 30, 2023

Short and full papers:

  • Abstract submission: April 13, 2023 April 27th, 2023 (23h59, AoE)
  • Paper submission: April 20, 2023 May 1st, 2023 (23h59, AoE)
  • Notification: June 9, 2023
  • Camera-ready paper: June 30, 2023

Conference: August 28 – September 1, 2023


Miguel R. Luaces
University of A Coruña, Spain
Christa Schwanninger


Program Committee

  • Deepak Dhungana, IMC Krems, AT
  • Sten Grüner, ABB Corporate Research, GER
  • Christoph Elsner, Siemens AG, GER
  • Albert Haag, Product Management GmbH, GER
  • Richard Comploi-Taupe, Siemens AG Österreich, AT
  • Maider Azanza, University of the Basque Country (UPV/EHU), ES
  • Andreas Falkner, Siemens AG Österreich, AT
  • Lidia Fuentes, Universidad de Málaga, ES
  • Iris Groher, Johannes Kepler University Linz, AT
  • Juha-Pekka Tolvanen, MetaCase, FI
  • Hironori Washizaki, Waseda University, JP
  • Jean-Marc Jézéquel, University of Rennes, FR
  • Sebastien Gerard, CEA, LIST, FR
  • Mehrdad Saadatmand, RISE Research Institutes of Sweden, SE
  • Alessandra Bagnato, Softeam, FR
  • Joost Noppen, British Telecom, UK
  • Martin Becker, Fraunhofer IESE Kaiserslautern, GER
  • Leticia Montalvillo Mendizabal, University of The Basque Country (UPV/EHU), ES
  • Paul Grünbacher, Johannes Kepler University Linz, AT
  • Danilo Beuche, pure-systems GmbH, GER
  • Goetz Botterweck, Trinity College Dublin, Lero, IE